3D Glass Solutions Inc.

About 3D Glass Solutions Inc.

3D Glass Solutions (3DGS) provides glass three-dimensional heterogeneous integration (3DHI) foundry services to commercial and defense manufacturers, academia, and government agencies, focusing on high-performance glass solutions for various applications.

Products & Services

Glass 3D Heterogeneous Integration (3DHI):Foundry services for commercial and defense manufacturers, academia, and government agencies using glass 3DHI technology.

High Performance Fused Silica (HPFS) Glass Solutions:Low loss coefficient glass for automotive radar substrates (70-150 GHz) and high frequency filters (10-100 GHz).

Wireless Communications Solutions:High performance RF subsystem implementation with SWaP-C benefits up to 500 GHz, including filters, antennas, and RF front ends.

Aerospace & Defense Solutions:3DHI with high temp and RAD HARD features, secure on-shore processing for space and Defense Industrial Base customers in the USA.

Photonics Platform:Thermal stability and isolation for lasers and Photonic Integrated Circuits (PIC) on glass substrates, with 3DHI for photonic subsystems.

HPC/AI Solutions:Glass substrates supporting large sizes, high interconnect density, and fine redistribution for Chiplet integration in the AI market.

Sensors:Glass features suited for bio-sensors and quantum dot sensors.

Specialties

3D Heterogeneous Integration (3DHI) High Performance Fused Silica (HPFS) Glass RF Subsystems Photonics High-Performance Computing (HPC)/AI Sensors Aerospace & Defense Solutions

Funding History

Debug: View Raw Funding Data

#	Type	Amount Fields	Date Fields	Investors
1	RT: Series C T: - FT: Series C	A: 30000000 MR: - FA: $30 million FAN: 30000000	D: 2023-04-19 FD: 2023-04-19	6 investors

Series C Latest

2023-04-19

$30.0M

6 investors (Pro only)

Growth Metrics

+45%

Employee Growth

YoY

3.2x

Funding Growth

Last Round

12

Markets

Operating

10K+

Customers

Active

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Team & Leadership

J

Jeb H. Flemming

CTO & Founder

J

Jennifer Ard

Managing Director and Head of Investment Operations

S

Shankar Chandran

Partner

B

Babu Mandava

PRESIDENT & CEO

J

Jeff Cunningham

Director

M

Madhavan Swaminathan

Department Head of Electrical Engineering and William E. Leonhard Endowed Chair at Penn State University

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