Amkor Technology, Inc.

About Amkor Technology, Inc.

Amkor Technology is a leading provider of semiconductor packaging and test services, focusing on enabling a resilient domestic semiconductor supply chain through advanced packaging and test facilities. Their mission involves delivering innovative solutions for the semiconductor industry with a global footprint.

Products & Services

Semiconductor Packaging:Offers a wide range of packaging solutions including Laminate (CABGA, FBGA, FCBGA, etc.), Leadframe (LQFP, TQFP, SOIC, etc.), Memory, MEMS and Sensors, Power Discrete, System in Package (SiP), and Wafer Level Packaging (WLCSP, WLFO).

Test Services:Provides comprehensive test services for semiconductors to ensure functionality and reliability.

Design Services:Includes package characterization and wafer bumping to support semiconductor design and manufacturing.

Technology Solutions:Advanced technologies like 2.5D/3D TSV, Flip Chip, S-Connect™, S-SWIFT™, and Package-on-Package for innovative IC packaging.

Specialties

Semiconductor Packaging Test Services Advanced IC Packaging Technologies (2.5D/3D TSV, Flip Chip, S-Connect™, S-SWIFT™) Wafer Level Packaging System in Package (SiP) MEMS and Sensors Power Discrete Solutions

Funding History

Debug: View Raw Funding Data

#	Type	Amount Fields	Date Fields	Investors
1	RT: Debt T: - FT: Debt	A: 500000000 MR: - FA: $500 million FAN: 500000000	D: 2025-09-22 FD: 2025-09-22	-
2	RT: Debt T: - FT: Debt	A: 400000000 MR: - FA: $400 million FAN: 400000000	D: 2025-09-08 FD: 2025-09-08	-

Debt Latest

2025-09-22

$500.0M

Debt 2025-09-08

$400.0M

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Growth Metrics

+45%

Employee Growth

YoY

3.2x

Funding Growth

Last Round

12

Markets

Operating

10K+

Customers

Active

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Team & Leadership

H

Hyang-Soo Kim

Honorary Chairman

J

Joo-Jin (James) Kim

Founder and Chairman Emeritus

J

James J. Kim

Chairman Emeritus

J

Joe Biden

President of the United States

J

James Kim

Founder & Chairman Emeritus

G

Giel Rutten

President & Chief Executive Officer

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