Qnity Electronics, Inc.

About Qnity Electronics, Inc.

Qnity partners with customers at the cutting edge of technology to enable breakthroughs in AI, advanced computing, and connectivity for next-generation devices. They provide high-performance materials and integration expertise to make tomorrow's technologies possible, focusing on semiconductor chip manufacturing and high-speed transmission in complex electronic systems.

Products & Services

Pyralux(r) Laminated Circuit Materials:Enables advanced applications like 5G, electric vehicles, and smart consumer electronics, meeting current needs and future challenges in material and design freedom.

Circuposit™ Electroless Copper:Designed for fine line and high-reliability performance on IC substrates, flexible, and rigid PCBs through desmear and electroless copper processes.

Kalrez(r) Specialty Sealants:O-rings and seals that meet the most demanding conditions in severe environments.

Ikonic™ CMP Pads:A breakthrough pad platform for chemical mechanical planarization (CMP) at advanced technology nodes, with Ikonic™ 9000 winning a 2025 Edison Award.

Laird™ Thermal Interface Materials:Performance leader in removing heat from powerful AI chips, automotive electronics, and other advanced devices.

Semiconductor Technologies Portfolio:Includes polishing pads (Ikonic™, Visionpad™), CMP slurries (Novaplane™, Acuplane™), advanced cleans (CuSolve™, PCMPSolv™), lithographic materials (EPIC™, AR™), specialized sealants (Kalrez(r)), and display materials for OLED technology.

Interconnect Solutions Portfolio:Includes advanced packaging materials (Intervia™, Solderon™, Nikal™), circuit materials (Circuposit™, Microfill™, Riston(r)), thermal and electromagnetic shielding solutions (Laird™, Tputty™, Tflex™, CoolZorb™), laminates for PCBs (Pyralux(r), Interra(r), Temprion(r)), polyimide films (Kapton(r), Oasis(r)), silver nanowire technologies, and electronic polymers.

Specialties

Artificial Intelligence (AI) Advanced Computing Advanced Connectivity Semiconductor Technologies Interconnect Solutions High-Performance Materials Chemical Mechanical Planarization (CMP) Thermal and Electromagnetic Shielding Flexible and Rigid-Flex PCBs

Funding History

Debug: View Raw Funding Data

#	Type	Amount Fields	Date Fields	Investors
1	RT: Investment T: - FT: Investment	A: 61500000 MR: - FA: $61.5 million FAN: 61500000	D: 2026-03-06 FD: 2026-03-06	-
2	RT: Debt Financing (Senior Secured Notes and Senior Notes) T: - FT: Debt Financing (Senior Secured Notes and Senior Notes)	A: 1750000000 MR: - FA: $1.75 billion FAN: 1750000000	D: 2025-08-12 FD: 2025-08-12	-
3	RT: Debt Financing (Senior Secured Notes and Senior Notes) T: - FT: Debt Financing (Senior Secured Notes and Senior Notes)	A: 2500000000 MR: - FA: $2.5 billion FAN: 2500000000	D: 2025-08-11 FD: 2025-08-11	-

Investment Latest

2026-03-06

$61.5M

Debt Financing (Senior Secured Notes and Senior Notes) 2025-08-12

$1.8B

Debt Financing (Senior Secured Notes and Senior Notes) 2025-08-11

$2.5B

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Growth Metrics

+45%

Employee Growth

YoY

3.2x

Funding Growth

Last Round

12

Markets

Operating

10K+

Customers

Active

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Team & Leadership

J

Jon Kemp

President of the Electronics business for DuPont and Chief Executive Officer-Elect

M

Matt Harbaugh

Chief Financial Officer-Elect

C

Chuck Xu

Vice President of the Electronics business for DuPont, to be appointed President Interconnect Solutions

S

Sang Ho Kang

Vice President of the Electronics business for DuPont

P

Peter Hennessey

General Counsel

K

Kathleen Fortebuono

Vice President, Global Rewards, and HR M&A

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